MediaTek Dimensity 9200 Chipset is Launched: Based on TSMC's 4NM Process and is expected to be used in phones.

MediaTek has announced the release of its new flagship mobile SoC. As a successor to the Dimensity 9000 Chipset, MediaTek has unveiled the Dimensity 9200 SoC. The new MediaTek SoC is the first to include the Cortex-X3 and Cortex-A715 cores from ARM. It is also the world's first smartphone platform to support Wi-Fi 7.

The ARMv9 architecture is used in the CPU and GPU designs. TSMC's second-generation 4nm process is also used to build the SoC. Smartphones powered by the new MediaTek Dimensity flagship SoC will be available soon. The company confirmed that smartphone brands will release devices by the end of 2022. Meanwhile, let's look at the features and specifications of the MediaTek Dimensity 9200 Chipset.

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MediaTek Dimensity 9200 Chipset: What’s New

The Dimensity 9200 Chipset from MediaTek is built on a new 4nm process. It will compete with smartphones equipped with the upcoming Snapdragon 8 Gen 2 SoC. The Dimensity 9200 Chipset has a 1 + 3 + 4 cluster configuration. It has a single Cortex-X3 Prime Core running at 3.05GHz. The three high-performance ARM Cortex-A715 cores run at 2.85GHz. Finally, the four Cortex A510 efficiency cores run at 1.8GHz.

The processor is paired with the new ARM Immortalis G715 GPU. It also supports hardware-based raytracing. The SoC also includes a new Application Processing Unit (APU) called the APU 690, which, in conjunction with the Imagiq 890 image signal processor (ISP), enables device makers to add unique AI-video enhancements that are significantly faster and more power efficient. The ISP supports simultaneous 4K HDR video recording on three cameras.

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The Dimensity 9200 Chipset can support Full HD displays at 240Hz, WQHD resolution displays at 144Hz, and 5K resolution displays at 60Hz. With the help of MediaTek's AI-SR/ MEMC, MediaTek claims that the Chipset provides best-in-class video streaming. The AI visual semantic display on the SoC optimizes image quality with multi-person segmentation and multi-layer colour management per scene.

LPDDR5X RAM and UFS 4.0 storage are supported by the Dimensity 9200 Chipset. It also supports 5G sub-6GHz and mmWave frequencies. Finally, Bluetooth 5.3 and Wi-Fi 7 standards are supported.

Phones equipped with the new flagship SoC will be available in the market by the end of 2022, according to MediaTek. The chipmaker, however, did not reveal a specific list of OEMs that will launch phones with the Dimensity 9200 Chipset. The new Dimensity 9200 Chipset is expected to power the Redmi K60 series. Vivo is also expected to release an X90 series phone with the new MediaTek flagship SoC.

More information about the launch will be made available in the coming days. Meanwhile, please share your thoughts on the new MediaTek Dimensity 9200 Chipset in the comments section below.

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